2 Layer PCB Assembly with Components
- Company Name:Board Electronics Co.,Ltd
- Membership:Free Member
- Member Since:2012. 03.11
- Country/Region:China
- City:Guangdong
- Contact:Donna Zhan
- Related Keywords:pcba, pcba board, pcba assembly, electronic pcba
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Board Electronics Co.,Ltd
[China]
Aluminum pcb:
We can offer normal and high thermal conductivity aluminum pcb(copper core pcb) for your led solution with very
good quality and delivery time. Normally are single layer and 2 layers pcb. Best price available.
Insulation thickness: 100-150um
Break-down voltage: AC 3.5 OR 6.0KV
Withstand voltage: DC 3.0 OR 4.0KV
Flammability: t1: 0, t2: 0
Glass Transition Temperature: 130 ℃
Dielectric Constant 1MHZ: 5.2
Thermal Stress: 288℃>120S
Heat Resistance: 0.6-0.8℃/W
CTI: >600V
Thermal Conductivity: 1.3, 1.6, 2.0, 3.2W/m.k
FR4 PCB:
Our products cover all PCB areas, including rigid, flex and rigid-flex circuit boards. And we have mastered micro-mechanical hole, high aperture ratio, high-precision impedance, HDI and other leading technologies with our advanced equipments.(From single layer to 18ths layers pcb, like flex pcb, rigid pcb, rigid-flex pcb, HDI, mobile phone pcb.)
Rigid PCB Technical Capabilities | |
Item | Manufacture Capability |
Layers | 2-18L |
Material Types | FR-4, CEM-1,CEM-3, IMS, High TG, |
High Frequency, Halogen Free, | |
Aluminum base, metal core base | |
Max.Panel Dimension | 546mm*622mm |
Outline Tolerance | ±0.10mm |
Board Thickness | 0.20mm-4.0mm |
Board thickness Tolerance(t=0.8mm) | ±8% |
Min.track Width | 0.075mm(3mil) |
Min.track Gap | 0.075mm(3mil) |
Surface treatment | HASL(LF), Flash gold, ENIG,OSP |
(Lead free compatible), Carbon ink, | |
Peelable S/M, Immersion Ag/Tin, | |
Gold finger plating, | |
ENIG+ Gold finger | |
External Cu.Thickness | 35um-210um(1oz-6oz) |
Internal Cu.Thickness | 17um-175um(0.5oz-5oz) |
Drilling Bit Size(CNC) | 0.10mm-5.95mm |
Finished Hole Dimension(CNC) | 0.20mm-6.0mm |
Hole Tolerance(CNC) | ±0.075mm/±0.05mm |
Hole Postion Tolerance(CNC) | ±0.05mm |
Board Thickness Min.Hole Dimension | 8:01 |
Performance Test | 100% electrical and electricity |
performance test | |
Solder Mask | LPI, green, black, white, |
red, blue, yellow | |
Min Solder Mask Bridge | 0.0635mm |
Thermal Shock Test | 288℃,10S,3X |
Impedance Control Tolerance | ±5% |
PCB Assembly Capacity | |
Item | Capability |
Min. IC Pitch | 0.30mm(12mil) |
Foot Pin | SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA |
Min. Chip Placement | 1005 |
Maximum BGA Size | 74mm x 74mm(2.9" x 2.9") |
BGA Ball Pitch | 1mm ~ 3mm(4mil ~ 12mil) |
BGA Ball Diameter | 0.4mm ~ 1mm(16mil ~ 40mil) |
QFP Lead Pitch | 0.38mm ~ 2.54mm(15mil ~ 100mil) |
Type of Assembly | SMT and Thru-hole |
Wave soldering | Yes |
Reflow soldering | Yes |
Testing | Flying Probe test, XRAY Inspection, AOI Test |
Package | Anti-static Bubble Bag & Carton |
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